MOQ : 1pcs
Price : negotiation
Payment Terms : TT, LC, and others base on negotiation
Supply Ability : 1, 000, 000PCS/week
Delivery Time : quick turn and normal type
Packaging Details : box
10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB
|
Product Description |
Model Number: |
CTE-008 |
Number of Layer: |
10layer |
Material: |
FR4 Tg170 |
Finish Thickness: |
3.0mm |
Finish copper: |
2OZ |
Surface Finish: |
Plating gold |
|
Green solder mask |
|
White silkscreen |
|
CNC routing V-CUT |
Place of Origin: |
China |
Brand Name: |
CHITUN |
Certification: |
UL,ROHS,ISO |
Standard: |
IPC or base on customers' requestion |
24Hours for urgent 1-2layers ,
2-4days for multilayer PCBs .
24 hour turnaround time on double-sided PCB’s,
2-4 day turn available up to ten layers;
over ten layers can be done in one week.
To shorten the cycle time of new product introduction.
Applications(Target Market):
Cooling and Washing machine, Switching Power Amplifiers, Home Computer, Home Theater/Stereo Surround Sound System, Cable Television Converter Box, Hand Held Video Games, Digital and analog Switching, Remote control electronic toys, Disk Drive duplication systems, LOJACK auto recovery system, Electronic Television Audience Measurement Systems/Electronic Audience Measurement Systems,Headphone Systems ect.
Technology Capability
Feature |
2015 |
2016 |
2017 |
|
Base Material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
|
Max. Layer Count |
24 |
30 |
32 |
|
Max. PCB Size (max.) |
558mm X 660mm |
558mm X 660mm |
558mm X 660mm |
|
Base copper |
1/3 oz - - 5 oz |
1/3 - - 5 oz |
1/3 - - 5 oz |
|
Copper thickness (outer) |
6 oz |
6 oz |
6 oz |
|
Max. Board Thickness mm (mil) |
3.4 (134) |
3.4 (134) |
3.4 (134) |
|
Min. Board Thickness mm (mil) |
0.1 (4) |
0.1 (4) |
0.1 (4) |
|
Min. Line Width / Spacing |
Inner um (mil) |
75/100 (3 4) |
75/75 (3/3) |
75/75 (3/3) |
Outer um (mil) |
100/100 (4/4) |
75/75 (3/3) |
75/75 (3/3) |
|
Min. Mechanical Drill Size (mm) |
0.2 |
0.2 |
0.2 |
|
Min. HWTC um (mil) |
175 (7) |
175 (7) |
175 (7) |
|
Min. Soldermask Opening um (mil) |
50 (2) |
50 (2) |
50 (2) |
|
Finest SMT Pitch mm (mil) |
0.40 (16) |
0.45 (18) |
0.45 (18) |
|
BGA Device Pitch (Base Copper 1oz) (mil) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
|
Type of Surface Finish |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
|
Impedance Control |
+/- 10% |
+/- 8% |
+/- 8% |
|
Warpage |
0.7% |
0.5% |
0.5% |
Special Technology: Impendence Control, Differencial PCB printed circuit board, Peelabemask PCB , High Density PCB HDI, Heavy copper PCB ,Metal Core circuit boards ,Copper Clad PCB printed circuit board, Blind & Buried Vias, Laser Drilled Vias, Burn-in Boards,Flex Boards, Rigid Flex PCB printed circuit board , Edge half plated thru hole Circuit boards, Selective Plating Hard Gold, Special Thin or Special Thick PCB board, PCB with Resin Plugged Hole
Advantage:
Trade Terms:
Minimum Order Quantity: |
1pcs |
Price: |
negotiation |
Packaging Details: |
box |
Delivery Time: |
quick turn and normal type |
Payment Terms: |
TT, LC, and others base on negotiation |
Supply Ability: |
1, 000, 000PCS/week |
10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB Images |